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Heat-resistant electronic systems and circuit boards

Metal fusion bonding – Solder form
Reexamination Certificate

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Heat-resistant exhaust manifold and method of preparing same

Metal fusion bonding – Process – Combined
Patent

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Heat-resistant exhaust manifold and method of preparing same

Metal fusion bonding – Process – Combined
Patent

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Heat-retaining exhaust components and method of preparing same

Metal fusion bonding – Process – Combined
Patent

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Heated filling device

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Heated tool with heated support

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent

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Heated tool with stop mechanism

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent

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Heater, reflow apparatus, and solder bump forming method and...

Metal fusion bonding – Process – Specific mode of heating or applying pressure
Reexamination Certificate

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Heating apparatus

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Reexamination Certificate

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Heating device for a bonding apparatus

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent

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Heating device for generating a wave of solder in a wave solderi

Metal fusion bonding – With control means responsive to sensed condition
Patent

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Heating head for soldering and de-soldering of SMD components

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Heating tip and method of manufacturing the same

Metal fusion bonding – Metallic heat applicator
Patent

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Helically formed welded pipe and diameter control

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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Helically seamed tubing and apparatus and method for making same

Metal fusion bonding – With means to deform work – filler – or flux portion before... – Comprising means forming one-piece blank into a tubular shape
Patent

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Hermetic bonded seal

Metal fusion bonding – Process – Using only pressure
Patent

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Hermetic package and packaged semiconductor chip having closely

Metal fusion bonding – Process – Plural joints
Patent

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Hermetic seal

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Reexamination Certificate

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Hermetic seal

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Reexamination Certificate

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Hermetic sealing of abutment joints by non-vacuum focused energy

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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