Hermetic package and packaged semiconductor chip having closely

Details Hermetic package and packaged semiconductor chip having closely Hermetic package and packaged semiconductor chip having closely

1992-08-27

1993-05-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228123, 437218, H01L 21603

Patent

active

052093905

ABSTRACT:
A hermetic semiconductor package having a ceramic lid with the device leads extending vertically through the lid is disclosed. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substantial lead density.

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