Metal fusion bonding – Process – Specific mode of heating or applying pressure
Reexamination Certificate
2005-03-29
2011-10-25
Ward, Jessica L (Department: 1735)
Metal fusion bonding
Process
Specific mode of heating or applying pressure
C432S152000, C266S105000
Reexamination Certificate
active
08042727
ABSTRACT:
An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted sufficiently, and an effect of reducing the possibility that solder particles join together can be expected.
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U.S Appl. No. 10/598,124 to Sakamoto et al., which was filed on Aug. 18, 2006.
English language Abstract of JP 11-068303.
English language Abstract of JP 11-251737.
English language Abstract of JP 2001-068848.
English language Abstract of JP2000-094179.
English language Abstract of JP 05-092257.
English language Abstract of JP 01-157796.
English language Abstract of JP 5-000391.
English language Abstract of JP 2002-353612.
English language Abstract of JP 2002-374063.
Ando Haruhiko
Furuno Masahiko
Hiratsuka Atsushi
Onozaki Junichi
Saito Hiroshi
D'Aniello Nicholas
Greenblum & Bernstein P.L.C.
Japan Science and Technology Agency
Tamura Corporation
Ward Jessica L
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