Heating apparatus

Details Heating apparatus Heating apparatus

2005-09-14

2010-02-16

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

C228S020100, C228S051000, C228S234100

Reexamination Certificate

active

07661573

ABSTRACT:
The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

REFERENCES:
patent: 4971554 (1990-11-01), Moore
patent: 5054681 (1991-10-01), Kim
patent: 6179196 (2001-01-01), Heim et al.
patent: 6897410 (2005-05-01), Ho et al.
patent: 2002/0084307 (2002-07-01), Ruszowski
patent: 5-109838 (1993-04-01), None
patent: 9-260834 (1997-10-01), None
patent: 2000-31217 (2000-01-01), None
patent: 2004-6453 (2004-01-01), None

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