4. Metal fusion bonding
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  6. With condition responsive, program, or timing control
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Single point bonding method

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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Solder bump measuring method and apparatus

Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate

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Solder head control mechanism

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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Solder iron pressure monitor and method of using same in...

Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate

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Soldering method and soldering apparatus

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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System and method to control solder reflow furnace with...

Metal fusion bonding – Process – With condition responsive – program – or timing control
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System for controllably conducting welding operations...

Metal fusion bonding – Process – With condition responsive – program – or timing control
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Systems and methods for manufacturing a circuit board

Metal fusion bonding – Process – With condition responsive – program – or timing control
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