Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1995-03-30
1997-09-02
Bradley, P. Austin
Metal fusion bonding
Process
With condition responsive, program, or timing control
2281791, 228 62, B23K 3102
Patent
active
056622635
ABSTRACT:
There is disclosed a single point TAB technology of sequentially bonding a number of inner leads to corresponding electrodes arranged along each edge of a rectangular principal surface of a semiconductor chip, one lead at a time. Of one array of inner leads arranged along one edge of the principal surface of the semiconductor chip, an inner lead located at a first corner of the one edge is firstly bonded to a corresponding electrode of the semiconductor chip, and thereafter, the inner leads are sequentially bonded to corresponding electrodes of the semiconductor chip in the order starting from an inner lead located at a second corner of the same one edge and reaching an inner lead located at a central portion of the same one edge, and then, the inner leads are sequentially bonded to corresponding electrodes of the semiconductor chip in the order starting from an inner lead next to the inner lead located at the first comer of the same one edge and reaching an inner lead just before the inner lead located at the central portion of the same one edge.
REFERENCES:
patent: 5269452 (1993-12-01), Sterczyk
T. Nemoto et al., "A Feasibility Study on Single Point Tab For Large Number of Lead Counts and Fine Pitch LSI", IMC 1990 Proceedings, May 30 -Jun. 1, 1990, pp. 202-207.
Bradley P. Austin
Knapp Jeffrey T.
NEC Corporation
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