Soldering method and soldering apparatus

Details Soldering method and soldering apparatus Soldering method and soldering apparatus

1993-06-08

1994-03-29

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228254, 228 8, 228 33, 222591, 118300, 427123, B23K 300, H05K 334

Patent

active

052977188

ABSTRACT:
The improvement in the soldering method of soldering a workpiece comprising the steps of forming a solder melting pot by engaging plural trowel members, supplying a solder tip having a constant volume to the solder melting pot, melting the solder tip and holding the molten solder temporarily in the solder melting pot and then separating the plural trowel members to allow the molten solder to drop onto the workpiece. The improvement comprises detecting complete melting of the solder tip by sensing the change in intensity of the light reflected by the surface of the molten solder, and heating the molten solder for an additional time period after the completion of melting of the solder tip. A soldering apparatus for use to realize the aforementioned method is also provided.

REFERENCES:
patent: 5038995 (1991-08-01), Nagata
patent: 5193738 (1993-03-01), Hayes
patent: 5238176 (1993-08-01), Nishimura

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