Solder head control mechanism

Details Solder head control mechanism Solder head control mechanism

1999-02-03

2000-09-19

Mills, Gregory

Metal fusion bonding

Process

With condition responsive, program, or timing control

22818021, 228 41, B23K 3100, B23K 3102, B23K 3700

Patent

active

061199184

ABSTRACT:
A solder head control mechanism which uses a movable small size and simply structured acoustic coil linear servomotor to directly drive a solder head to perform soldering operation. The solder head links with a position sensor, a controller and a current output actuator to form a closed loop control mechanism which has small inertia, fast response time and great positioning accuracy. The controller may dynamically change amplifying value to actuate the solder head.

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