Vacuum package having vacuum-deposited local getter and its prep

Details Vacuum package having vacuum-deposited local getter and its prep Vacuum package having vacuum-deposited local getter and its prep

1997-06-11

1999-07-13

Ryan, Patrick

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228217, 228221, B23K 3102, B23K 120

Patent

active

059214619

ABSTRACT:
A vacuum package (20) is fabricated by providing a package base (22) with a device (32) affixed to the interior of the package base (22), and a package lid (42). An activatable getter material (54) is deposited onto a preselected region of either the interior (48) of the package lid (42) or that portion of the package base (22) which does not have the device (32) affixed thereto. The deposited getter material (54) is deposited at a temperature such that it is activated during deposition. The vacuum package lid (42) is sealed to the vacuum package base (22). The steps of depositing and sealing are conducted in an evacuated vacuum chamber without exposing the interior to atmosphere.

REFERENCES:
patent: 5328078 (1994-07-01), Okumura
patent: 5729086 (1998-03-01), Cho et al.
patent: 5734226 (1998-03-01), Cathey
patent: 5751107 (1998-05-01), Komatsu
patent: 5789859 (1998-08-01), Cathey et al.

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