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Wafer-to-wafer transfer of microstructures using break-away teth

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent

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Wave soldering fixture

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Reexamination Certificate

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Weld centering workpiece holder

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent

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Welding jig

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent

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Wire bonding method and apparatus with lead pressing means

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent

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Wire bonding tool

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent

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Wire clamp and wire bonding apparatus having the same

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Reexamination Certificate

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Wire clamping plate

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Reexamination Certificate

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Wire placement fixture

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent

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