Wafer-to-wafer transfer of microstructures using break-away teth

Details Wafer-to-wafer transfer of microstructures using break-away teth Wafer-to-wafer transfer of microstructures using break-away teth

1997-05-31

2000-11-07

Ryan, Patrick

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228120, 228138, 228177, 228191, 414935, 414936, 257737, B23K 3102, B23K 1018, H01L 2352, B65G 4907

Patent

active

061423580

ABSTRACT:
Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.

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