Wire bonding method and apparatus with lead pressing means

Details Wire bonding method and apparatus with lead pressing means Wire bonding method and apparatus with lead pressing means

1990-10-23

1993-03-30

Seidel, Richard K.

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228212, 269903, H01L 2160

Patent

active

051976528

ABSTRACT:
In a wire bonding method and apparatus to bond electrodes on pellets to leads on lead frames, substrates, when such a bonding is performed, a portion of the lead away from bonding point of the lead is pressed by a pressing section of pressing arm which is moved vertically and horizontally by lead pressing device.

REFERENCES:
patent: 3648354 (1972-03-01), Mashino et al.
patent: 3995845 (1976-01-01), Scheffer
patent: 4053096 (1977-10-01), Heim
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4600138 (1986-07-01), Hill
patent: 4821945 (1989-04-01), Chase et al.

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