Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent
1975-02-07
1976-08-03
Aegerter, Richard E.
Metal fusion bonding
Including means to force or clamp work portions together...
Work portion comprises electrical component
29203J, 29203P, 73 88B, 219 85G, 228179, B23K 1900
Patent
active
039724638
ABSTRACT:
A microcircuit adhesion testing method and fixture for uniform placement and soldering of a preselected length of wire above a film pad on a microcircuit substrate with consistent substrate-to-wire spacing, comprising a holder for the substrate, finger spacers attached to the holder, and a member for pressing the wire against the spacers. The spacers are made of a material which is not wettable with solder of the type used to attach the wire to the film.
REFERENCES:
patent: 1363933 (1920-12-01), Trimble
patent: 1456506 (1923-05-01), Leveridge
patent: 2755760 (1956-07-01), Fermanian et al.
patent: 2835962 (1958-05-01), Tally et al.
patent: 2921550 (1960-01-01), Goodykoontz et al.
patent: 3634930 (1972-01-01), Cranston
patent: 3855850 (1974-12-01), Norskog
patent: 3859715 (1975-01-01), Duffek et al.
Conlon Edward James
DeStephanis Ralph
Hitch Thomas Tipton
Aegerter Richard E.
Christoffersen H.
Muckelroy W. L.
RCA Corporation
Shepperd John W.
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