Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-08-20
2000-09-05
Kincaid, Kristine
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174 522, 257693, H01L 2302
Patent
active
061146277
ABSTRACT:
An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die, extending from the bonding location of the die and the edge of the die, in order to prevent filler particles from lodging between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The seal created by the underfill material reduces point stresses on the active surface of the die usually caused by the filler particles. The decreased flexure in the leads further enhances the locking of the leads in position with respect to the die.
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Kincaid Kristine
Micro)n Technology, Inc.
Ngo Hung V
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