Ultrahigh-frequency electronic component

Details Ultrahigh-frequency electronic component Ultrahigh-frequency electronic component

1997-05-13

1999-03-30

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 257728, 257790, H01L 2328

Patent

active

058892320

ABSTRACT:
An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

REFERENCES:
patent: 3670091 (1972-06-01), Frantz et al.
patent: 5706175 (1998-01-01), Takei

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