Power semiconductor module with a connected substrate...

Details Power semiconductor module with a connected substrate... Power semiconductor module with a connected substrate...

2008-07-28

2010-06-22

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S732000, C257SE21001

Reexamination Certificate

active

07741711

ABSTRACT:
A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cutout is smaller at the inner surface than at the outer surface. The housing has an extension that reaches into the cutout and may be deformed to form a riveted connection. The method comprises: forming a housing with at least one extension which extends towards the exterior of the module, wherein the extension projects through the cutout and beyond the outer surface of the carrier; and deforming the end of the extension so that it widens and forms a riveted connection and at the same time lies below the outer surface of the carrier.

REFERENCES:
patent: 101 00 460 (2002-07-01), None
patent: 101 39 287 (2003-03-01), None
patent: WO 03/015167 (2003-02-01), None

Affiliated with

Also associated with

Rating

Power semiconductor module with a connected substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power semiconductor module with a connected substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power semiconductor module with a connected substrate... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4206690