Package, electronic device, substrate having a separation...

Details Package, electronic device, substrate having a separation... Package, electronic device, substrate having a separation...

2011-04-12

2011-04-12

Arroyo, Teresa M (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S678000, C257S787000, C257S774000, C257SE21523, C257S698000

Reexamination Certificate

active

07923835

ABSTRACT:
An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.

REFERENCES:
patent: 2001-77238 (2001-03-01), None

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