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Determining an endpoint in a polishing process

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Device and control unit for belt sanding systems

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Device for detecting a displacement of a blade member of a slici

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Device for finishing curved work piece surfaces using a...

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Device for polishing peripheral edge of semiconductor wafer

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Device for processing the finish of work pieces

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Dicing machine with non-contact setup function

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Double side wafer grinder and methods for assessing...

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Double side wafer grinder and methods for assessing...

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Double-sided simultaneous grinding method, double-sided...

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Dressing apparatus and substrate holding apparatus

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Dynamic lot allocation based upon wafer state...

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