Device for polishing peripheral edge of semiconductor wafer

Details Device for polishing peripheral edge of semiconductor wafer Device for polishing peripheral edge of semiconductor wafer

2007-10-17

2011-10-04

Rachuba, Maurina (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S011000, C451S044000

Reexamination Certificate

active

08029333

ABSTRACT:
A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

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