4. Stock material or miscellaneous articles
  5. Structurally defined web or sheet
  6. Discontinuous or differential coating, impregnation or bond

Kathleen Ann Stalter

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Process for forming cone shaped solder for chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Process for forming cone shaped solder for chip interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Structure, materials, and applications of ball grid array...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Structure, materials, and methods for socketable ball grid

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Structure, materials, and methods for socketable ball grid

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1213982

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