Structure, materials, and methods for socketable ball grid

Details Structure, materials, and methods for socketable ball grid Structure, materials, and methods for socketable ball grid

1998-06-30

2000-09-19

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428328, 428620, 428901, 257698, 257738, 257783, 257788, B32B 700, B32B 1516, H01L 2912, H01L 2348

Patent

active

06120885&

ABSTRACT:
A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

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