Method of forming salicide poly gate with thin gate oxide and ul

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

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438592, H01L 214763

Patent

active

061658812

ABSTRACT:
I A method is achieved for removing a hardmask from a feature on a semiconductor wafer. The method comprises the following phases: depositing a buffer layer overall; etching back the buffer layer in an etching apparatus to expose the hardmask; etching the hardmask in the etching apparatus; and etching of the remaining buffer layer in the etching apparatus.

REFERENCES:
patent: 4657628 (1987-04-01), Holloway et al.
patent: 5061647 (1991-10-01), Roth et al.
patent: 5372673 (1994-12-01), Stager et al.
patent: 5431770 (1995-07-01), Lee et al.
patent: 5837588 (1998-11-01), Wu
patent: 5968336 (1999-10-01), Rolferson
patent: 5985761 (1999-11-01), Sparks et al.

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