Capacitor that includes high permittivity capacitor dielectric

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S238000, C438S240000, C257S516000, C257S532000

Reexamination Certificate

active

07745279

ABSTRACT:
A decoupling capacitor is formed on a semiconductor substrate that includes a silicon surface layer. A substantially flat bottom electrode is formed in a portion of the semiconductor surface layer. A capacitor dielectric overlies the bottom electrode. The capacitor dielectric is formed from a high permittivity dielectric with a relative permittivity, preferably greater than about 5. The capacitor also includes a substantially flat top electrode that overlies the capacitor dielectric. In the preferred application, the top electrode is connected to a first reference voltage line and the bottom electrode is connected to a second reference voltage line.

REFERENCES:
patent: 4069094 (1978-01-01), Shaw et al.
patent: 4314269 (1982-02-01), Fujiki
patent: 4497683 (1985-02-01), Celler et al.
patent: 4631803 (1986-12-01), Hunter et al.
patent: 4892614 (1990-01-01), Chapman et al.
patent: 4946799 (1990-08-01), Blake et al.
patent: 4952993 (1990-08-01), Okumura
patent: 5130773 (1992-07-01), Tsukada
patent: 5155571 (1992-10-01), Wang et al.
patent: 5273915 (1993-12-01), Hwang et al.
patent: 5338960 (1994-08-01), Beasom
patent: 5378919 (1995-01-01), Ochiai
patent: 5447884 (1995-09-01), Fahey et al.
patent: 5461250 (1995-10-01), Burghartz et al.
patent: 5479033 (1995-12-01), Baca et al.
patent: 5525828 (1996-06-01), Bassous et al.
patent: 5534713 (1996-07-01), Ismail et al.
patent: 5596529 (1997-01-01), Noda et al.
patent: 5629544 (1997-05-01), Voldman et al.
patent: 5656524 (1997-08-01), Eklund et al.
patent: 5708288 (1998-01-01), Quigley et al.
patent: 5714777 (1998-02-01), Ismail et al.
patent: 5763315 (1998-06-01), Benedict et al.
patent: 5789807 (1998-08-01), Correale, Jr.
patent: 5811857 (1998-09-01), Assaderaghi et al.
patent: 5955766 (1999-09-01), Ibi et al.
patent: 5965917 (1999-10-01), Maszara et al.
patent: 5972722 (1999-10-01), Visokay et al.
patent: 6008095 (1999-12-01), Gardner et al.
patent: 6015990 (2000-01-01), Hieda et al.
patent: 6015993 (2000-01-01), Voldman et al.
patent: 6027988 (2000-02-01), Cheung et al.
patent: 6046487 (2000-04-01), Benedict et al.
patent: 6059895 (2000-05-01), Chu et al.
patent: 6096591 (2000-08-01), Gardner et al.
patent: 6100153 (2000-08-01), Nowak et al.
patent: 6100204 (2000-08-01), Gardner et al.
patent: 6103599 (2000-08-01), Henley et al.
patent: 6107125 (2000-08-01), Jaso et al.
patent: 6111267 (2000-08-01), Fischer et al.
patent: 6190996 (2001-02-01), Mouli et al.
patent: 6222234 (2001-04-01), Imai
patent: 6232163 (2001-05-01), Voldman et al.
patent: 6256239 (2001-07-01), Akita et al.
patent: 6258664 (2001-07-01), Reinberg
patent: 6281059 (2001-08-01), Cheng et al.
patent: 6291321 (2001-09-01), Fitzgerald
patent: 6294834 (2001-09-01), Yeh et al.
patent: 6303479 (2001-10-01), Snyder
patent: 6339232 (2002-01-01), Takagi
patent: 6358791 (2002-03-01), Hsu et al.
patent: 6387739 (2002-05-01), Smith, III
patent: 6407406 (2002-06-01), Tezuka
patent: 6413802 (2002-07-01), Hu et al.
patent: 6414355 (2002-07-01), An et al.
patent: 6420218 (2002-07-01), Yu
patent: 6429061 (2002-08-01), Rim
patent: 6433382 (2002-08-01), Orlowski et al.
patent: 6448114 (2002-09-01), An et al.
patent: 6448613 (2002-09-01), Yu
patent: 6475838 (2002-11-01), Bryant et al.
patent: 6475869 (2002-11-01), Yu
patent: 6489215 (2002-12-01), Mouli et al.
patent: 6489664 (2002-12-01), Re et al.
patent: 6489684 (2002-12-01), Chen et al.
patent: 6495900 (2002-12-01), Mouli et al.
patent: 6498359 (2002-12-01), Schmidt et al.
patent: 6518610 (2003-02-01), Yang et al.
patent: 6521952 (2003-02-01), Ker et al.
patent: 6524905 (2003-02-01), Yamamichi et al.
patent: 6525403 (2003-02-01), Inaba et al.
patent: 6541343 (2003-04-01), Murthy et al.
patent: 6555839 (2003-04-01), Fitzgerald
patent: 6558998 (2003-05-01), Belleville et al.
patent: 6573172 (2003-06-01), En et al.
patent: 6576526 (2003-06-01), Kai et al.
patent: 6586311 (2003-07-01), Wu
patent: 6600170 (2003-07-01), Xiang
patent: 6617643 (2003-09-01), Goodwin-Johansson
patent: 6621131 (2003-09-01), Murthy et al.
patent: 6633070 (2003-10-01), Miura et al.
patent: 6653700 (2003-11-01), Chau et al.
patent: 6657259 (2003-12-01), Fried et al.
patent: 6657276 (2003-12-01), Karlsson et al.
patent: 6674100 (2004-01-01), Kubo et al.
patent: 6686247 (2004-02-01), Bohr
patent: 6690082 (2004-02-01), Lakshmikumar
patent: 6720619 (2004-04-01), Chen et al.
patent: 6724019 (2004-04-01), Oda et al.
patent: 6737710 (2004-05-01), Cheng et al.
patent: 6740535 (2004-05-01), Singh et al.
patent: 6759717 (2004-07-01), Sagarwala et al.
patent: 6762448 (2004-07-01), Lin et al.
patent: 6784101 (2004-08-01), Yu et al.
patent: 6794764 (2004-09-01), Kamal et al.
patent: 6797556 (2004-09-01), Murthy et al.
patent: 6798021 (2004-09-01), Ipposhi et al.
patent: 6803641 (2004-10-01), Papa Rao et al.
patent: 6812103 (2004-11-01), Wang et al.
patent: 6821840 (2004-11-01), Wieczorek et al.
patent: 6867101 (2005-03-01), Yu
patent: 6872610 (2005-03-01), Mansoori et al.
patent: 6885084 (2005-04-01), Murthy et al.
patent: 6891192 (2005-05-01), Chen et al.
patent: 6924181 (2005-08-01), Huang et al.
patent: 6969618 (2005-11-01), Mouli
patent: 2001/0028089 (2001-10-01), Adan
patent: 2002/0008289 (2002-01-01), Murota et al.
patent: 2002/0031890 (2002-03-01), Watanabe et al.
patent: 2002/0045318 (2002-04-01), Chen et al.
patent: 2002/0074598 (2002-06-01), Doyle et al.
patent: 2002/0076899 (2002-06-01), Skotnicki et al.
patent: 2002/0125471 (2002-09-01), Fitzgerald et al.
patent: 2002/0153549 (2002-10-01), Laibowitz et al.
patent: 2002/0163036 (2002-11-01), Miura et al.
patent: 2002/0190284 (2002-12-01), Murthy et al.
patent: 2003/0001219 (2003-01-01), Chau et al.
patent: 2003/0030091 (2003-02-01), Bulsara et al.
patent: 2003/0072126 (2003-04-01), Bhattacharyya
patent: 2003/0080386 (2003-05-01), Ker et al.
patent: 2003/0080388 (2003-05-01), Disney et al.
patent: 2003/0098479 (2003-05-01), Murthy et al.
patent: 2003/0136985 (2003-07-01), Murthy et al.
patent: 2003/0183880 (2003-10-01), Goto et al.
patent: 2004/0016972 (2004-01-01), Singh et al.
patent: 2004/0026765 (2004-02-01), Currie et al.
patent: 2004/0070035 (2004-04-01), Murthy et al.
patent: 2004/0087098 (2004-05-01), Ng et al.
patent: 2004/0140506 (2004-07-01), Singh et al.
patent: 2004/0173815 (2004-09-01), Yeo et al.
patent: 2004/0179391 (2004-09-01), Bhattacharyya
patent: 2004/0217448 (2004-11-01), Kumagai et al.
patent: 2004/0262683 (2004-12-01), Bohr et al.
patent: 2004/0266116 (2004-12-01), Mears et al.
patent: 2005/0029601 (2005-02-01), Chen et al.
patent: 2005/0121727 (2005-06-01), Ishitsuka et al.
patent: 2005/0224986 (2005-10-01), Tseng et al.
patent: 2005/0224988 (2005-10-01), Tuominen
patent: 2005/0236694 (2005-10-01), Wu et al.
patent: 2006/0001073 (2006-01-01), Chen et al.
patent: 0 683 522 (1995-11-01), None
patent: 0 828 296 (1998-03-01), None
patent: WO 03/017336 (2003-02-01), None
Wolf, S., et al., “Silicon Processing for the VLSI Era,” vol. 1: Process Technology Second Addition, Lattice Press, Sunset Beach, CA, pp. 374-385.
Wolf, S., “Silicon Processing for the VLSI Era,” vol. 2: Process Integration, Lattice Press, Sunset Beach, CA, pp. 658-663.
“Future Gate Stack,” International Sematech, 2001 Annual Report.
Blaauw, D., et al., “Gate Oxide and Subthreshold Leakage Characterization, Analysis and Optimization,” date unknown.
Cavassilas, N., et al., “Capacitance-Voltage Characteristics of Metal-Oxide-Strained Semiconductor Si/SiGe Heterostructures,” Nanotech 2002, vol. 1, pp. 600-603.
Chang, L., et al., “Direct-Tunneling Gate Leakage Current in Double-Gate and Ultrathin Body MOSFETs,” 2002 IEEE Transactions on Electron Devices, vol. 49, No. 12, Dec. 2002, pp. 2288-2295.
Chang, L., et al., “Reduction of Direct-Tunneling Gate Leakage Current in Double-Gate and Ultra-Thin Body MOSFETs,” IEEE, 2001, pp. 4 pages.
Gámiz, F., et al., “Electron Transport in Strained Si Inversion Layers Grown on SiGe-on-Insulator Substrates,” Journal of Applied Physics, vol. 92, No. 1, Jul. 1, 2002, pp. 288-295.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Capacitor that includes high permittivity capacitor dielectric does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Capacitor that includes high permittivity capacitor dielectric, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitor that includes high permittivity capacitor dielectric will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4211454

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.