Integrated circuit package system with edge connection system

Details Integrated circuit package system with edge connection system Integrated circuit package system with edge connection system

2006-05-30

2010-06-08

Chu, Chris C (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23172, C257S685000, C257S698000, C438S106000, C438S109000, C361S752000

Reexamination Certificate

active

07732907

ABSTRACT:
An integrated circuit package system including a plurality of substrates and a plurality of semiconductor devices formed on each of the substrates. An edge connection system is provided and an electrical edge connector on each of the substrates is for attachment to the edge connection system. A vertically stacked configuration of the substrates is formed by attaching the substrates to the edge connection system.

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patent: 2006/0097402 (2006-05-01), Pu et al.
patent: 2006/0170090 (2006-08-01), Shinma et al.

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