Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-12-08
2008-08-05
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S258000, C438S593000, C438S508000, C438S508000
Reexamination Certificate
active
07407856
ABSTRACT:
A method of manufacturing a memory device includes defining a field region and an active region in a substrate, forming a field oxide layer on the field region, forming an insulating layer on the active region, patterning the insulating layer to form first and second bit lines separated from and parallel to each other on the active region, forming a memory element for storing data in a nonvolatile state, wherein the memory element passes across the first and second bit lines, and forming a word line on the insulating layer and the memory element.
REFERENCES:
patent: 5117269 (1992-05-01), Bellezza et al.
patent: 5831894 (1998-11-01), Chang
patent: 5999444 (1999-12-01), Fujiwara et al.
patent: 6150198 (2000-11-01), Wen
patent: 6212103 (2001-04-01), Ahrens et al.
patent: 6249454 (2001-06-01), Sung et al.
patent: 6307782 (2001-10-01), Sadd et al.
patent: 6320784 (2001-11-01), Muralidhar et al.
patent: 6342716 (2002-01-01), Morita et al.
patent: 6391730 (2002-05-01), Kluth et al.
patent: 6400610 (2002-06-01), Sadd
patent: 6470424 (2002-06-01), Forbes
patent: 6413819 (2002-07-01), Zafar et al.
patent: 6574144 (2003-06-01), Forbes
patent: WO 00/08649 (2000-02-01), None
Kim Byong-man
Yoo In-kyeong
Le Dung A.
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
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