Metal gated ultra short MOSFET devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S346000, C257S387000, C257S388000, C257S412000, C257SE29027

Reexamination Certificate

active

07348629

ABSTRACT:
MOSFET devices suitable for operation at gate lengths less than about 40 nm, and methods of their fabrication is being presented. The MOSFET devices include a ground plane formed of a monocrystalline Si based material. A Si based body layer is epitaxially disposed over the ground plane. The body layer is doped with impurities of opposite type than the ground plane. The gate has a metal with a mid-gap workfunction directly contacting a gate insulator layer. The gate is patterned to a length of less than about 40 nm, and possibly less than 20 nm. The source and the drain of the MOSFET are doped with the same type of dopant as the body layer. In CMOS embodiments of the invention the metal in the gate of the NMOS and the PMOS devices may be the same metal.

REFERENCES:
patent: 4899202 (1990-02-01), Blake et al.
patent: 5780899 (1998-07-01), Hu
patent: 6180978 (2001-01-01), Chatterjee
patent: 6271551 (2001-08-01), Schmitz et al.
patent: 6417538 (2002-07-01), Choi
patent: 6555872 (2003-04-01), Dennen
patent: 6770944 (2004-08-01), Nishinohara
patent: 2005/0139926 (2005-06-01), Shimizu
patent: 2006/0214241 (2006-09-01), Pidin

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