Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-11-20
2007-11-20
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C257SE21179
Reexamination Certificate
active
11195201
ABSTRACT:
A manufacturing method for a dual bit flash memory includes providing a semiconductor substrate and depositing a charge-trapping dielectric layer with the depositing performed without using ammonia at an ultra-slow deposition rate. First and second bitlines are implanted and a wordline layer is deposited. A hard mask layer is deposited over the wordline layer. A photoresist is deposited over the wordline layer and used to form a hard mask. The photoresist is removed. The wordline layer is processed using the hard mask to form a wordline and the hard mask is removed. A reduced hydrogen, high-density data retention liner to reduce charge loss, covers the wordline and the charge-trapping dielectric layer. An interlayer dielectric layer is deposited over the data retention liner.
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Gao Pei-Yuan
Halliyal Arvind
Hopper Dawn
Kamal Tazrien
Ngo Minh Van
Booth Richard A.
Ishimaru Mikio
Spansion LLC
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