Semiconductor memory with data retention liner

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21179

Reexamination Certificate

active

11195201

ABSTRACT:
A manufacturing method for a dual bit flash memory includes providing a semiconductor substrate and depositing a charge-trapping dielectric layer with the depositing performed without using ammonia at an ultra-slow deposition rate. First and second bitlines are implanted and a wordline layer is deposited. A hard mask layer is deposited over the wordline layer. A photoresist is deposited over the wordline layer and used to form a hard mask. The photoresist is removed. The wordline layer is processed using the hard mask to form a wordline and the hard mask is removed. A reduced hydrogen, high-density data retention liner to reduce charge loss, covers the wordline and the charge-trapping dielectric layer. An interlayer dielectric layer is deposited over the data retention liner.

REFERENCES:
patent: 4108106 (1978-08-01), Dozier
patent: 4651406 (1987-03-01), Shimizu et al.
patent: 5120672 (1992-06-01), Mitchell et al.
patent: 5151375 (1992-09-01), Kazerounian et al.
patent: 6190966 (2001-02-01), Ngo et al.
patent: 6346467 (2002-02-01), Chang et al.
patent: 6413887 (2002-07-01), Fukuda et al.
patent: 2003/0017698 (2003-01-01), Ikeda

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor memory with data retention liner does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor memory with data retention liner, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor memory with data retention liner will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3861733

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.