Method of forming a memory cell having self-aligned contact...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S259000, C438S270000, C438S299000, C438S296000, C438S298000, C438S306000, C438S307000, C438S308000, C438S309000, C438S310000, C438S311000, C257SE21659, C257SE21660, C257SE21613

Reexamination Certificate

active

11141312

ABSTRACT:
A memory cell of a semiconductor device and a method for forming the same, wherein the memory cell includes a substrate having active regions and field regions, a gate layer formed over the substrate, the gate layer including a plurality of access gates formed over the active regions of the substrate and a plurality of pass gates formed over the field regions of the substrate, first self-aligned contact regions formed between adjacent pass gates and access gates, and second self-aligned contact regions formed between adjacent access gates, wherein a width of each of the first self-aligned contact regions is larger than a width of each of the second self-aligned contact regions.

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