Process kit for improved power coupling through a workpiece...

Details Process kit for improved power coupling through a workpiece... Process kit for improved power coupling through a workpiece...

2007-01-16

2007-01-16

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298150, C118S720000, C118S721000, C118S728000, C118S504000, C156S345510

Reexamination Certificate

active

10804254

ABSTRACT:
Apparatus for supporting a substrate such as a semiconductor wafer in a process chamber to improve power coupling through the substrate. The apparatus contains a pedestal assembly and a pedestal cover positioned over the top surface of and circumscribing the pedestal assembly for electrically isolating the pedestal assembly. The pedestal cover reduces conductive film growth in the wafer process region. As such, RF wafer biasing power from the pedestal assembly remains coupled through the substrate during processing.

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