Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-09-11
2007-09-11
Estrada, Michelle (Department: 2823)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S386000, C438S393000, C438S396000, C257SE23077, C257SE23132, C257SE23134
Reexamination Certificate
active
11064163
ABSTRACT:
The invention includes semiconductor constructions comprising dielectric materials which contain cerium oxide and titanium oxide. The dielectric materials can contain a homogeneous distribution of cerium oxide and titanium oxide, and/or can contain a laminate of cerium oxide and titanium oxide. The dielectric materials can be incorporated into any suitable semiconductor devices, including, for example, capacitor devices, transistor devices, and flash memory devices. The invention also includes methods of utilizing atomic layer deposition to form laminates of cerium oxide and titanium oxide.
REFERENCES:
patent: 6258654 (2001-07-01), Gocho
patent: 6451647 (2002-09-01), Yang et al.
patent: 6509234 (2003-01-01), Krivokapic
patent: 6528858 (2003-03-01), Yu et al.
patent: 6797567 (2004-09-01), Chang
patent: 6812514 (2004-11-01), Yang et al.
patent: 6815297 (2004-11-01), Krivokapic
patent: 6858514 (2005-02-01), Hsu et al.
patent: 6995437 (2006-02-01), Kinoshita et al.
patent: 2002/0195683 (2002-12-01), Kim et al.
patent: 2003/0124792 (2003-07-01), Jeon et al.
patent: 2004/0057193 (2004-03-01), Moon et al.
patent: 2004/0183116 (2004-09-01), Cho et al.
patent: 2004/0185613 (2004-09-01), Lin et al.
patent: 2004/0235242 (2004-11-01), Basceri et al.
patent: 2005/0035410 (2005-02-01), Yeo et al.
patent: 2005/0224897 (2005-10-01), Chen et al.
Osten, H. et al., “High-k Gate Dielectrics with Ultra-Low Leakage Current Based on Praseodymum Oxide”, IEEE Apr. 2000, pp. 653-656.
Sneh, O. et al., “Thin Film Atomic Layer Deposition Equipment for Semiconductor Processing”, Thin Solid Films 402 (2002), pp. 248-261.
McKee, R. et al., “Physical Structure and Inversion Charge at a Semiconductor Interface with a Crystalline Oxide”, http://www.sciencemag.org/cgi/content/full/293/5529/468, reprinted Jul. 16, 2002, 9 pages.
McKee, R. et al., “Crystalline Oxides on Silicon: The First Five Monolayers”, Physical Review Letters, vol. 81, No. 14, Oct. 5, 1998, pp. 3014-3017.
Wu, Y. et al., “Electrical Characteristics of High Quality La2O3Gate Dielectric with Equivalent Oxide Thickness of 5 Å”, IEEE vol. 21, No. 7, Jul. 2000, pp. 341-343.
Mölsä, H. et al., “Deposition of Cerium Dioxide Thin Films on Silicon Substrates by Atomic Layer Epitaxy”, Mat. Res. Soc. Symp. Proc., vol. 335, 1994 Materials Research Society, pp. 341-350.
Wilk, G. et al., “High-k Gate Dielectrics: Current Status and Materials Properties Considerations”, Jour. App. Phys., vol. 89, No. 10, May 15, 2001, pp. 5243-5275.
Nishikawa, Y. et al., “Electrical Properties of Single Crystalline CeO2High-k Dielectrics Directly Grown on Si (111)”, Jpn. J. Appl. Phys., vol. 41, Part 1, No. 4B, Apr. 2002, pp. 2480-2483.
Kukli, K. et al., “Atomic Layer Deposition of Titanium Oxide from Til4and H2O2”, Chem. Vap. Deposition, vol. 6, No. 6, 2000, pp. 303-310.
Becht, M. et al., “Some Cerium β-Diketonate Derivatives as MOCVD Precursors”, Chem. Mater., vol. 5, No. 1, 1993, pp. 137-144.
Zhang, H . et al., “Atomic Layer Deposition of High Dielectric Constant Nanolaminates”, J. of the Electrochemical Soc., vol. 148, No. 4, 2001, pp. F63-F66.
Ahn Kie Y.
Forbes Leonard
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