Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-01-09
2007-01-09
Dang, Trung (Department: 2823)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S284000, C257SE21178
Reexamination Certificate
active
11066703
ABSTRACT:
In an exemplary embodiment, a fin active region is protruded along one direction from a bulk silicon substrate on which a shallow trench insulator is entirely formed so as to cover the fin active region. The shallow trench insulator is removed to selectively expose an upper part and sidewall of the fin active region, along a line shape that at least one time crosses with the fin active region, thus forming a trench. The fin active region is exposed by the trench and thereon a gate insulation layer is formed. Thereby, productivity is increased and performance of the device is improved. A fin FET employs a bulk silicon substrate of which a manufacturing cost is lower than that of a conventional SOI type silicon substrate. Also, a floating body effect can be prevented, or is substantially reduced.
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Lee Choong-Ho
Lee Chul
Yoon Jae-Man
Dang Trung
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
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