Method and apparatus for simulating standard test wafers

Details Method and apparatus for simulating standard test wafers Method and apparatus for simulating standard test wafers

2007-09-18

2007-09-18

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Gas phase etching of substrate

With measuring, testing, or inspecting

C216S041000, C216S079000, C438S014000, C438S689000

Reexamination Certificate

active

11244335

ABSTRACT:
A method and apparatus are provided for simulating a standard wafer in semiconductor manufacturing equipment. The apparatus includes a support layer suitable for being handled by the semiconductor manufacturing equipment. Applied to the support layer is a mixture including a process agent and a material. During use, the present invention simulates a standard production wafer including material similar to that in the mixture of the present invention.

REFERENCES:
patent: 5521052 (1996-05-01), Rahman et al.
patent: 6081659 (2000-06-01), Garza et al.

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