Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-05-15
2007-05-15
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S198000, C438S199000, C438S268000, C438S276000, C438S279000
Reexamination Certificate
active
10222997
ABSTRACT:
A method for forming NMOS and PMOS transistors that includes cutting a substrate along a higher order orientation and fabricating deep sub-micron NMOS and PMOS transistors on the vertical surfaces thereof. The complementary NMOS and PMOS transistors form a CMOS transistor pair. The transistors are preferably used in structures such as memory circuits, e.g., DRAMs, which are, in turn, used in a processor-based system. Ideally, the deep sub-micron NMOS and PMOS transistors are operated in velocity saturation for optimal switching operation.
REFERENCES:
patent: 3603848 (1971-09-01), Sato
patent: 4236166 (1980-11-01), Cho et al.
patent: 4670768 (1987-06-01), Sunami et al.
patent: 4768076 (1988-08-01), Aoki et al.
patent: 4857986 (1989-08-01), Kinugawa
patent: 5227660 (1993-07-01), Horiuchi et al.
patent: 5296403 (1994-03-01), Nishizawa et al.
patent: 5384473 (1995-01-01), Yoshikawa et al.
patent: 5616935 (1997-04-01), Koyama et al.
patent: 5691230 (1997-11-01), Forbes
patent: 5883012 (1999-03-01), Chiou et al.
patent: 5895948 (1999-04-01), Mori et al.
patent: 5942768 (1999-08-01), Zhang
patent: 5963800 (1999-10-01), Augusto
patent: 5991225 (1999-11-01), Forbes et al.
patent: 6037610 (2000-03-01), Zhang et al.
patent: 6114205 (2000-09-01), Mori
patent: 6245615 (2001-06-01), Noble et al.
patent: 6307214 (2001-10-01), Ohtani et al.
patent: 6383871 (2002-05-01), Noble et al.
patent: 6436748 (2002-08-01), Forbes et al.
K. Shenai “Electron mobilities in MOS channels formed along anisotropically dry etched <110> silicon trench sidewalls”, Apr. 1991, IEEE, vol. 27, No. 9, pp. 715-717.
Onodera et al. “Theoretical study of the piezoeletric effect on Gas MESFET's on (100), (011, and (111) Ga as (111) As substrates”, Sep. 1989, IEEE, vol. 36, No. 9, pp. 1580-1585.
Balk; “Orientation Dependence of Built-In Surface Charge on Thermally Oxidized Silicon”; Proceedings of the IEEE, vol. 53, p. 2133-34, 1965.
Carr et al.; “MOS/LSI Design and Applications”; McGraw-Hill Book Company, p. 37, 49-52, 1972.
Sato et al.; “Drift-Velocity Saturation of Holes in Si Inversion Layers”; J. Phys. Soc. Japan, vol. 31, p. 1346, 1971.
Sato et al.; “Mobility Anisotropy of Electrons in Inversion Layers on Oxidized Silicon Surfaces”; Physical Review B, vol. 4, No. 6, Sep. 15, 1971; p. 1950-60.
Vitkavage et al.; “An investigation of Si-SiO2 interface charges in thermally oxidized (100), (110), (111), and (511) silicon”; J. Appl. Phys. vol. 68, No. 10, Nov. 15, 1990; p. 5262-72.
Forbes Leonard
Noble Wendell P.
Reinberg Alan R.
Dickstein & Shapiro LLP
Graybill David E.
Micro)n Technology, Inc.
LandOfFree
Method of forming vertical sub-micron CMOS transistors on... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming vertical sub-micron CMOS transistors on..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming vertical sub-micron CMOS transistors on... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3724321