Methods of fabrication metal oxide semiconductor (MOS)...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S270000, C438S271000, C438S589000, C438S149000, C438S479000, C438S517000, C438S221000, C438S296000, C438S353000

Reexamination Certificate

active

07122431

ABSTRACT:
Methods of forming a unit cell of a metal oxide semiconductor (MOS) transistor are provided. An integrated circuit substrate is formed. A MOS transistor is formed on the integrated circuit substrate. The MOS transistor has a source region, a drain region and a gate. The gate is between the source region and the drain region. The first and second spaced apart buffer regions are formed beneath the source region and the drain region and between respective ones of the source region and integrated circuit substrate and the drain region and the integrated circuit substrate.

REFERENCES:
patent: 5418393 (1995-05-01), Hayden
patent: 5891763 (1999-04-01), Wanlass
patent: 11-261068 (1999-09-01), None
“Notice to File Response to a Rejection,” from the Korean Intellectual Property Office, corresponding to Korean Patent Application No. 2002-02995, dated Sep. 13, 2004.

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