Method of forming a MIM capacitor for Cu BEOL application

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S303000, C257S306000, C257S310000, C257S532000, C257SE27048, C257SE27071

Reexamination Certificate

active

07091542

ABSTRACT:
The present invention relates generally to integrated circuits, and particularly, but not by way of limitation, metal-insulator-metal (MIM) capacitors formed within a trench located within a metallization layer and in particular to MIM capacitors for Cu BEOL semiconductor devices.

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