Planarized copper cleaning for reduced defects

Details Planarized copper cleaning for reduced defects Planarized copper cleaning for reduced defects

2006-09-12

2006-09-12

Goudreau, George A. (Department: 1763)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C438S692000, C438S747000, C438S749000, C438S750000, C438S754000

Reexamination Certificate

active

07104267

ABSTRACT:
A process for treating a copper or copper alloy substrate surface with a composition and corrosion inhibitor solution to minimize defect formation and surface corrosion, the method including applying a composition including one or more chelating agents, a pH adjusting agent to produce a pH between about 3 and about 11, and deionized water, and then applying a corrosion inhibitor solution. The composition may further comprise a reducing agent and/or corrosion inhibitor. The method may further comprise applying the corrosion inhibitor solution prior to treating the substrate surface with the composition.

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