Method of locating conductive spheres utilizing screen and...

Details Method of locating conductive spheres utilizing screen and... Method of locating conductive spheres utilizing screen and...

2006-09-12

2006-09-12

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S108000, C228S245000, C228S041000

Reexamination Certificate

active

07105432

ABSTRACT:
Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

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