4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Marjorie L. Waddel

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Apparatus for attaching solder balls to BGA package...

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Reexamination Certificate

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Apparatus for attaching solder balls to BGA package...

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate

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Apparatus for locating conductive spheres utilizing screen...

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate

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Method of attaching solder balls to BGA package utilizing a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method of attaching solder balls to BGA package utilizing a...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2073254

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