Methods and processes utilizing microwave excitation

Details Methods and processes utilizing microwave excitation Methods and processes utilizing microwave excitation

2006-09-12

2006-09-12

Chen, Bret (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C427S595000

Reexamination Certificate

active

07105208

ABSTRACT:
The invention includes methods and processes in which microwave radiation is utilized to activate at least one component within a reaction chamber during deposition of a material over a substrate within the reaction chamber.

REFERENCES:
patent: 4778561 (1988-10-01), Ghanbari
patent: 5134965 (1992-08-01), Tokuda et al.
patent: 5327150 (1994-07-01), Cherrette
patent: 5545258 (1996-08-01), Katayama et al.
patent: 5645644 (1997-07-01), Mabuchi et al.
patent: 5653841 (1997-08-01), Krishnamurthy et al.
patent: 5698036 (1997-12-01), Ishii et al.
patent: 5749966 (1998-05-01), Shates
patent: 5788778 (1998-08-01), Shang et al.
patent: 5951887 (1999-09-01), Mabuchi et al.
patent: 5988104 (1999-11-01), Nambu
patent: 6040021 (2000-03-01), Miyamoto
patent: 6133807 (2000-10-01), Akiyama et al.
patent: 6158383 (2000-12-01), Watanabe et al.
patent: 6311638 (2001-11-01), Ishii et al.
patent: 6347602 (2002-02-01), Goto et al.
patent: 6416822 (2002-07-01), Chiang et al.
patent: 6446573 (2002-09-01), Hirayama et al.
patent: 6454912 (2002-09-01), Ahn et al.
patent: 6527908 (2003-03-01), Kanetsuki et al.
patent: 0 520 832 (1992-12-01), None
patent: 1 115 147 (2001-07-01), None

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