Post etching treatment process for high density oxide etcher

Details Post etching treatment process for high density oxide etcher Post etching treatment process for high density oxide etcher

2005-08-09

2005-08-09

Goudreau, George A. (Department: 1763)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001200, C134S022100, C216S068000, C216S071000, C438S695000, C438S729000, C438S734000

Reexamination Certificate

active

06926011

ABSTRACT:
A three-step polymer removal process that reverses the conventional sequence in which polymer is removed. In the preferred embodiment of the present invention the polymer is first removed from the Gas Deposition Table, after this the polymer is stripped from the inner surface of the created contact hole.

REFERENCES:
patent: 5607880 (1997-03-01), Suzuki et al.
patent: 5611888 (1997-03-01), Bosch et al.
patent: 5647953 (1997-07-01), Williams et al.
patent: 5667631 (1997-09-01), Holland et al.
patent: 5968278 (1999-10-01), Young et al.
patent: 6227211 (2001-05-01), Yang et al.
patent: 6491042 (2002-12-01), Young et al.
patent: 2003/0089382 (2003-05-01), Young et al.

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