Method for manufacturing a semiconductor device with using...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S202000, C438S205000, C438S657000

Reexamination Certificate

active

06939769

ABSTRACT:
The present invention provides a method for manufacturing a semiconductor device capable of acquiring productivity when a p-type source/drain is formed by the implantation of a BF2and B ions. The method for manufacturing a semiconductor device includes the steps of: implanting a BF2ion in a p-type source/drain region on a silicon substrate with an ion implantation energy of from about 10 keV to about 20 keV; implanting B ion in the p-type source/drain region with an ion implantation energy of from about 5 keV to about 10 keV; and forming a p-type source/drain by carrying out a thermal treatment.

REFERENCES:
patent: 5077226 (1991-12-01), Youn et al.
patent: 5225357 (1993-07-01), Ho
patent: 5763920 (1998-06-01), Momuro
patent: 6569742 (2003-05-01), Taniguchi et al.
patent: 1999-57331 (1999-07-01), None
Parab et al., “Detailed analysis and computaitnally efficient modeling of ultra shallow as implanted rofiles obtained by low energy BBF2, and As ion implantation”, IEEE, pp. 559-562, 1997.
Tasch et al., “Experimental Observations and Modeling of Ultra-Shallow BF2 and As Implants In Single Crystal Silicon”, JVS. Technology B 12 (1), Jan./Feb. 1994, pp. 166-171.
Parab et al., “Detailed Analysis and Computationally Efficient Modeling of Ultra Shallow Dopant Profiles Obtained by Low Energy B/BF2 and As Ion Implantation”, IEEE, 1997, pp. 559-562.
Notice of Preliminary Rejection from the Korean Intellectual Property Office dated May 26, 2003, 2 pages, with English translation (1 page).
English abstract for KR 1999-57331, 1 page.

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