Methods of forming integrated circuits with thermal oxide...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S311000, C438S664000, C438S682000, C438S592000, C257S408000

Reexamination Certificate

active

06890823

ABSTRACT:
Methods of forming thermal oxide layers on a side wall of gate electrodes are disclosed. In particular, thermal oxide layers can be formed on a side wall of a gate electrode by forming a gate electrode on an integrated circuit substrate and forming a thermal oxide layer on a side wall of the gate electrode using a thermal oxidation process. A silicide layer can be formed on the gate electrode after the formation of the thermal oxide layer.

REFERENCES:
patent: 5200352 (1993-04-01), Pfiester
patent: 5508541 (1996-04-01), Hieda et al.
patent: 6211026 (2001-04-01), Ahmad et al.
patent: 6274445 (2001-08-01), Nouri
patent: 6281085 (2001-08-01), Yeo
patent: 6413829 (2002-07-01), Yu
patent: 6455366 (2002-09-01), Lee
patent: 6521955 (2003-02-01), Ida et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of forming integrated circuits with thermal oxide... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of forming integrated circuits with thermal oxide..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming integrated circuits with thermal oxide... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3378423

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.