Method and apparatus for chemical mechanical polishing of...

Details Method and apparatus for chemical mechanical polishing of... Method and apparatus for chemical mechanical polishing of...

2008-05-20

2008-05-20

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S631000, C438S633000, C438S645000, C438S692000, C257SE21303, C257SE21496

Reexamination Certificate

active

07375023

ABSTRACT:
Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

REFERENCES:
patent: 6432823 (2002-08-01), Huynh et al.
patent: 6444569 (2002-09-01), Farkas et al.

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