Method of producing a digital fingerprint sensor and the...

Details Method of producing a digital fingerprint sensor and the... Method of producing a digital fingerprint sensor and the...

2008-07-01

2008-07-01

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S055000, C257S417000, C257S467000, C257SE29324, C257SE21502

Reexamination Certificate

active

07393711

ABSTRACT:
An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electrical connections. The sensor further includes a molded protective resin at least partly covering the substrate and the chip and completely encapsulating the wire-bonding wires. The resin forms, on at least one side of the chip and at most three sides, a bump rising to at least 500 microns above the sensitive surface, this bump encapsulating the wire-bonding wires and constituting a guide for a finger, the fingerprint of which it is desired to detect.

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patent: 6653723 (2003-11-01), Manansala
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patent: 0789334 (1997-08-01), None
patent: 1136936 (2001-09-01), None
patent: 61 032535 (1986-02-01), None
patent: 02 069386 (2002-09-01), None

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