Memory cells, methods of forming dielectric materials, and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21180, C257SE21680, C257SE21681

Reexamination Certificate

active

07968406

ABSTRACT:
Some embodiments include memory cells. The memory cells may include a tunnel dielectric material, a charge-retaining region over the tunnel dielectric material, crystalline ultra-high k dielectric material over the charge-retaining region, and a control gate material over the crystalline ultra-high k dielectric material. Additionally, the memory cells may include an amorphous region between the charge-retaining region and the crystalline ultra-high k dielectric material, and/or may include an amorphous region between the crystalline ultra-high k dielectric material and the control gate material. Some embodiments include methods of forming memory cells which contain an amorphous region between a charge-retaining region and a crystalline ultra-high k dielectric material, and/or which contain an amorphous region between a crystalline ultra-high k dielectric material and a control gate material.

REFERENCES:
patent: 6297095 (2001-10-01), Muralidhar et al.
patent: 6310376 (2001-10-01), Ueda et al.
patent: 6461909 (2002-10-01), Marsh et al.
patent: 6737313 (2004-05-01), Marsh et al.
patent: 6933218 (2005-08-01), Lee et al.
patent: 7005697 (2006-02-01), Batra
patent: 7112485 (2006-09-01), Vaartstra
patent: 7199023 (2007-04-01), Ahn et al.
patent: 7400012 (2008-07-01), Bhattacharyya
patent: 7575978 (2009-08-01), Kraus et al.
patent: 2001/0015453 (2001-08-01), Agarwal
patent: 2002/0153579 (2002-10-01), Yamamoto
patent: 2006/0261441 (2006-11-01), Marsh et al.
patent: 2007/0048953 (2007-03-01), Gealy et al.
patent: 2007/0102742 (2007-05-01), Kil et al.
patent: 2007/0132010 (2007-06-01), Bhattacharyya
patent: 2008/0002330 (2008-01-01), Park
patent: 2008/0150003 (2008-06-01), Chen et al.
patent: 2008/0274615 (2008-11-01), Vaartstra
patent: 2009/0097320 (2009-04-01), Min et al.
patent: 2009/0267129 (2009-10-01), Kim et al.
patent: 2009/0283817 (2009-11-01), Krishnamohan et al.
patent: PCTUS2009067387 (2010-07-01), None
Conley, Jr., J. F. et al., “Atomic Layer Deposition of Hafnium Oxide Using Anhydrous Hafnium Nitrate”, Electrochemical and Solid-State Letters, 5 (5) C57-059 (2002).
Aarik, Jaan, et al., “Phase transformations in hafnium dioxide thin films grown by atomic layer deposition at high temperatures”, Applied Surface Science 173 (2001) 15-21.
Aarik, Jaan, et al., “Influence of substrate temperature on atomic layer growth and properties of HfO2 thin films”, Thin Solid Films 340 (1999) 110-116.
Hirano, T. et al., “High Performance nMOSFET with HfSix/HfO2 Gate Stack by Low Temperature Process”, Semiconductor Technology Development Group, Semiconductor Solutions Network Company, Sony Corporation, 2005, IEEE, 4 pages.
Alshareef, H.N. et al., “Thermally Stable N-Metal Gate MOSFETs Using La-Incorporated HfSiO Dielectric”, 2006 Symposium on VLSI Technology Digest of Technical Papers, IEEE, 2 pages.
Takahashi, Kensuke et al., “High Mobility Dual Metal Gate MOS Transistors with High-k Gate Dielectrics”, Extended Abstracts of the 2004 International Conference on Solid State Devices and Materials, Tokyo, 2004, pp. 22-23.
Akasaka, Y. et al., “Material Selection for the Metal Gate/High-k Transistors”, Extended Abstracts of the 2004 International Conference on Solid State Devices and Materials, Tokyo, 2004, pp. 196-197.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Memory cells, methods of forming dielectric materials, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Memory cells, methods of forming dielectric materials, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Memory cells, methods of forming dielectric materials, and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2633289

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.