Methods of fabricating ferroelectric capacitors

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438 3, 438254, 438397, H01L 2120, H01L 218242

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active

058438181

ABSTRACT:
Methods of producing ferroelectric capacitors where the electrodes are formed in a contact hole. These methods include the steps of forming an insulating layer on an integrated circuit substrate. A contact hole is then formed through the insulating layer layer to expose a region of the integrated circuit substrate and to define a storage node pattern. A layer of oxidation-resistant conductive material is formed in the contact hole and the insulating layer removed to define a first storage electrode by exposing the layer of oxidation-resistant conductive material. A ferroelectric layer is then formed on the first storage electrode and a second storage electrode is formed on the ferroelectric layer opposite the first storage electrode.

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