Method and system for electrical coupling to copper interconnect

Details Method and system for electrical coupling to copper interconnect Method and system for electrical coupling to copper interconnect

1997-10-20

2000-06-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438710, 438906, H01L 2144

Patent

active

060718137

ABSTRACT:
A system and method for providing electrical connection to a copper interconnect through a via hole is disclosed. The copper interconnect includes a surface having impurities. The method and system include chemically reducing the copper oxide and removing the carbon atoms at the surface. The chemical etching is performed using a reactive species. The reactive species reacts with the impurities on the surface of the copper interconnect to remove the impurities.

REFERENCES:
patent: 5395650 (1995-03-01), Holl et al.

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