Method of making multilayered circuit board

Details Method of making multilayered circuit board Method of making multilayered circuit board

1993-08-26

1994-11-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 174266, 427 96, 427 97, H05K 336

Patent

active

053597672

ABSTRACT:
A method of making a multilayered circuit board wherein at least two layered subassemblies, each comprising a dielectric layer and at least one conductive layer therein, are bonded together. Each subassembly includes a through-hole extending therethrough which is aligned with a respective through-hole of the other prior to bonding. The subassemblies are compressed at a predetermined pressure (e.g., 300 psi) and then heated to a first temperature (e.g., 300.degree. C.) for an established time period, resulting in formation of a bond between the two through-holes. The resulting alloy formed from this bond possesses a melting point significantly greater than that of the subassembly dielectric (e.g., PTFE). Following this time period, the compressed subassemblies are heated to an even greater temperature (e.g., 380.degree. C.), again for an established time period, to assure dielectric flow. The subassembly is then cooled and the pressure removed. The method possesses two significant features: (1) effective engagement between respective pairs of through-holes in the compressed subassemblies; and (2) prevention of dielectric incursion within the bond formed between the respective pairs of through-holes, which incursion could adversely affect the electrical connection therebetween.

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