Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1997-10-27
2000-03-14
Nelms, David
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438706, 438725, 438733, 438738, 438742, 438743, 438744, H01L 2131
Patent
active
060372761
ABSTRACT:
A method for improving the patterning process of a conductive layer using a dual-layer cap of oxynitride and silicon nitride. The oxynitride layer acts as a BARC (Bottom Anti-Reflective Coating) to improve photolithography process performance. The oxynitride is formed by plasma-enhanced chemical vapor deposition.
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Jeng Erik S.
Lin Hua-Tai
Yao Liang-Gi
Berry Renee R.
Nelms David
Vanguard International Semiconductor Corporation
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