Stack gate flash memory cell featuring symmetric self aligned co

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438264, H01L 218247

Patent

active

060372230

ABSTRACT:
A process for fabricating a flash memory cell, featuring self-aligned contact structures, overlying and contacting, self-aligned source, and self-aligned drain regions, located between stack gate structures, has been developed. The stack gate structures, located on an underlying silicon dioxide, tunnel oxide layer, are comprised of: a capping insulator shape; a polysilicon control gate shape; an inter-polysilicon dielectric shape; and a polysilicon floating gate shape. The use of self-aligned contact structures, and self-aligned source regions, allows increased cell densities to be achieved.

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